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For Chilean Students

Eduardo Neale-Silva Scholarship Fund for Chilean Students

Application Guidelines

Application deadlines are March 1st for students hoping to study in Madison during the following fall term or academic year, and October 1st for students hoping to study in the spring term. Please contact IESP at international@engr.wisc.edu if you’d like to submit an application after these deadlines. Late applications will be accepted on a space-available basis.

Please submit the following application materials (6 points below) to the University of Wisconsin-Madison College of Engineering in care of Amanda Hammatt.

1. The UW Application for International and Special Students

2. Official University Transcript

   • The transcript should list all undergraduate and graduate courses you have taken and the grades you received .

   • Must have official university stamp or seal (handwritten forms are not accepted)

   • Must be in English

3. TOEFL Score Report

4. Statement of Financial Support

   The US Immigration and Naturalization Service requires that international students studying in the United States show that they have enough financial resources for their stay. In order to be approved for your student visa, therefore, you must prove you have available an amount of support equal to at least $14,000/academic year or $7,000/semester.

   This proof must come in one of the following forms:

   • A bank statement in your name showing a balance in the amount required

   • A Certification of Financial Support signed both by your parents (or financial sponsor) and his/her bank. If the bank will not sign the Certification of Financial Support, you can submit the Certification of Financial Support signed only by your parent (or financial sponsor) and either a bank statement in that person's name or a different letter from the bank with the bank's signature and official seal.

   • If your sponsor is a corporation or university, submit an award letter from that sponsor stating the exact amount and term of that financial support.

5. Transcript Release Form

6. DS-2019 Application